Advanced Failure Analysis Techniques

• Electron beam techniques for localizing defects under metal layers
• Scanning optical microscopy techniques for defect localization and imaging from the front on backside of silicon devices
• Resistive interconnect and soft defect localization
• Focused ion beam techniques
• Fluorescent microthermal imaging for detecting milli-degree temperature variations with submicron resolution

Electrical Failure Analysis Laboratory

• Integrated circuit testers
• Agilent and IMS
• Computer controlled
• Parametric testing
• Probers for up to 8" wafers

Scanning Electron Microscope Laboratories

• Three Scanning Electron Microscopes (SEM's)
• Field Emission SEM
• Electrical access to all SEM chambers
• Schlumberger IDS5000 and IDS1000 dynamic voltage contrast electron beam testers

Optical Microscopy Laboratory

• Optical microscopes
• Light emission microscope
• Two scanning laser microscopes

Scanning Probe Microscope Laboratory

• Scanning force microscope (contact and non-contact modes)

Focused Ion Beam System

• Micron 9000 system with metal and dielectric deposition