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The Advanced Micro- systems Packaging organization develops technologies that support the delivery of integrated microsystems to a diverse customer base with components from Sandia’s microsystems organizations and commercial suppliers.
Cartoon illustrating the 32 layer 3-D package
Our activities involve
- research
- development
- deliveryof new packaging technologies required
to integrate a diverse set of components
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Components include
- micromachines
- advanced photonics
- microsensors
- rf devices
- analog and digital integrated circuits
Our six major thrust areas are listed
below.
A section with more
detail is available.
- 3D Packaging
- MEMS Packaging
- Thermal Management & Microfluidic Technologies
- Advanced MCM Technology
- COTS/PEMS Reliability
- Rapid Hybrid Prototyping
It is critical for Sandia to develop ways of integrating
these dissimilar technologies to deliver microsystems
needed for our mission of national security.
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