|
3D Packaging
High capability, small volume packaging solutions are
necessary to microsystems.
Packaging diagram
View a larger version of this diagram.
MEMS Packaging
Advanced packaging integrates MEMS into microsystems.
Packaged microsystem
Thermal Management
We apply thermal management through passive and active
cooling technologies for high power, low volume applications.
Model of thermal activity
|
|
Advanced MCM Technology
Advanced MCM Technology integrates high density interconnection
for maximum performance in multi-chip modules.
Active cooling built into MCM technology
COTS/PEMS Reliability
A challenge we face is determining the reliability and
risks associated with using commercial-off-the-shelf,
plastic-encapsulated microelectronics.
COTS/PEMS
Rapid Hybrid Prototyping
We provide packaging solutions from prototyping to WR-certification
for a wide range of products.
Packaged prototype
|
